X -a M1 Test recapitulativ
Authored by Hallof Emerik
Other, Education
10th Grade
Used 2+ times
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18 questions
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1.
MULTIPLE CHOICE QUESTION
1 min • 1 pt
Wire-wrapping-ul este :
Un procedeu de interconectare a echipamentelor
Este un procedeu de interconectare prin rasucirea cablului pe un pin
Este un procedeu de conectare a capacitorilor
Este un procedeu de verificare al conductoarelor
2.
MULTIPLE SELECT QUESTION
1 min • 1 pt
Dupa numarul de plane cablajele imprimate pot fi:
simple
duble
multistrat
triplustrat
quadruple
3.
MULTIPLE CHOICE QUESTION
1 min • 1 pt
SMT resprezinta
surface mounted technology
surface mounted technique
surface mounted talent
surfface mounted device
4.
MULTIPLE SELECT QUESTION
1 min • 1 pt
Materialiul folosit pentru lipirea componentelor manual se numeste
Fludor
Acid aceto salicilic
Cositor
pasta decapanta
5.
MULTIPLE CHOICE QUESTION
1 min • 1 pt
Cel mai utilizat decapant folosit este
acidul ascorbic
acidul ribo nucleic
acidul aceto salicilic
colofoniul
6.
MULTIPLE SELECT QUESTION
1 min • 1 pt
Cel mai utilizate componente folosite la eliminarea caldurii in electronica sunt
ventilatoarele
dispoizitivele care permit circulatia curentilor de aer
radiatoarele
elementele radiante
7.
MULTIPLE SELECT QUESTION
45 sec • 1 pt
Conductibilitatea semiconductorului creste odata cu cresterea caldurii!
Adevarat
Fals
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